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APTC

APTC

TSV Etcher

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Description

As TSV(Through Silicon Via), which is deep silicon etching, becomes popular, high etch rate and hardware reliability are the key issues. Our system can now etch 150 ~ 300 um depth via holes with 50um CD at the etch rate of 10um/min with the Bosch process. 

Inquiry

Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664

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