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Flip Chip Bonding System
Model Name
FCB-80
Series
Semiconductor
Data
-
Manufacturer information
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AP-TechSemi conductor equipment manufacturer, WLP, CSP, COG, Camera Module and more
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Manufacturer
AP-Tech
Brand
-
SKU
53652
Product Name
Flip Chip Bonding System
Model Name
FCB-80
Size
-
Weight
-
Product Details

AP-Tech Flip Chip Bonding System FCB-80

AP-Tech Flip Chip Bonding System FCB-80 1



AP-Tech Flip Chip Bonding System FCB-80 2



AP-TechSemi conductor equipment manufacturer, WLP, CSP, COG, Camera Module and more
AP-Tech was founded in January 2005 and has been producing a wide variety of products related to the IT industry such as SEMICONDUCTORS, LCDs, OLEDs, LEDs, CAMERA MODULES and other Factory Automation.  AP-Tech always pursues the realization of customer satisfaction with the best quality products. Also AP-Tech will continue to research and develop for processing high source technology to give the best quality equipment.  To become the world’s leading company in the 21st century, AP-Tech corporation aims to create a new chapter in our corporate history through ceaseless technological development and investment. Through our motto “Any Possible Technology at Any Industry," AP-Tech will promise all of you that we will become a company which can give a huge impression to our customers. All employees of AP-Tech are doing ther best to learn and train through systematic training to always serve you with new satisfactions. We established an international standard quality management system and achieved a zero rate of products return. 
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