AM TECHNOLOGY
AM TECHNOLOGY
Description
Feature
- Set a stability by substantial & simple frame
- Low breakage-rate during process
- Automatic size controller & correction system
- Automatic Dressing System
- Process control and easy to driving by optimized program
- Back Grinding Machine images.
Application
- Silicon Wafer, SiC Wafer, Sapphire, Metals, Ceramics, Carbons,Glasses, Plastics, Composites
Specifications
Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664
ⓒ2024 Komachine Inc. All rights reserved.