Information
189 Gunsu 1-gil, Jiksan-eup, Seobuk-gu, Cheonan, Chungcheongnam-do, South Korea
-
-
-
Overview
- Summary
- TSE, established in 1994, is a company producing innovative products in the field of semiconductor interface and advanced display inspection equipment. It specializes in supplying test sockets, probe cards, and test interface boards essential for the complete inspection of high-speed semiconductor devices. The company is growing into a global standard in the OLED tester market, with recognized technological prowess.TSE, established in 1994, is a company producing innovative products in the field of semiconductor interface and advanced display inspection equipment. It specializes in supplying test sockets, probe cards, and test interface boards essential for the complete inspection of high-speed semiconductor devices. The company is growing into a global standard in the OLED tester market, with recognized technological prowess.
- Key Products/Technologies
- The company offers semiconductor test solutions including probe cards, interface boards, test sockets, and MEMS products. Probe cards are core components for inspecting DRAM, NAND Flash, non-memory semiconductors (AP, CIS, etc.), and HBM wafers. Interface boards provide optimal solutions for verifying the performance of high-speed memory devices like DDR, LPDDR, GDDR, and non-memory devices such as CPUs, GPUs, PMICs, and SoCs. Test sockets include elastomer sockets and rubber-type sockets necessary for high-speed semiconductor device inspection. MEMS products involve the development and supply of LC components for loopback testing of high-speed IOs like PCIe, MIPI, and SerDes.The company offers semiconductor test solutions including probe cards, interface boards, test sockets, and MEMS products. Probe cards are core components for inspecting DRAM, NAND Flash, non-memory semiconductors (AP, CIS, etc.), and HBM wafers. Interface boards provide optimal solutions for verifying the performance of high-speed memory devices like DDR, LPDDR, GDDR, and non-memory devices such as CPUs, GPUs, PMICs, and SoCs. Test sockets include elastomer sockets and rubber-type sockets necessary for high-speed semiconductor device inspection. MEMS products involve the development and supply of LC components for loopback testing of high-speed IOs like PCIe, MIPI, and SerDes.
- Display test systems encompass OLED and LED inspection equipment, performing electrical inspection of TFT array states through ATS (Array Test System) equipment. It provides comprehensive solutions addressing diverse customer needs, from OLED TVs to AR/VR glass displays. These systems integrate glass transfer equipment, electrical test equipment, software implementation technology, large-capacity data processing, and AI technology.Display test systems encompass OLED and LED inspection equipment, performing electrical inspection of TFT array states through ATS (Array Test System) equipment. It provides comprehensive solutions addressing diverse customer needs, from OLED TVs to AR/VR glass displays. These systems integrate glass transfer equipment, electrical test equipment, software implementation technology, large-capacity data processing, and AI technology.
- Key technologies include Simulation Based Design (SI/PI), TRE technology, Multi Parallel technology, High-Speed Test Interface technology, and Ultra-High-Speed IO PCB Design and 3D Simulation Technology. The company also possesses technology to precisely design and manufacture conductive particles, a core material for elastomer sockets, based on its proprietary MEMS Fab.Key technologies include Simulation Based Design (SI/PI), TRE technology, Multi Parallel technology, High-Speed Test Interface technology, and Ultra-High-Speed IO PCB Design and 3D Simulation Technology. The company also possesses technology to precisely design and manufacture conductive particles, a core material for elastomer sockets, based on its proprietary MEMS Fab.
- Core Advantages
- Proprietary MEMS Fab utilization for conductive particle development and manufacturing technology enhances test socket durability and minimizes semiconductor package damage, representing a differentiated competitive edge. This is a critical technological strength for high-speed semiconductor testing.Proprietary MEMS Fab utilization for conductive particle development and manufacturing technology enhances test socket durability and minimizes semiconductor package damage, representing a differentiated competitive edge. This is a critical technological strength for high-speed semiconductor testing.
- Internalization of key raw materials like probe card PCBs through its subsidiary TigerElec and Pogo Pins through Megatouch ensures cost competitiveness and stable product supply, demonstrating strong vertical integration capabilities.Internalization of key raw materials like probe card PCBs through its subsidiary TigerElec and Pogo Pins through Megatouch ensures cost competitiveness and stable product supply, demonstrating strong vertical integration capabilities.
- Supply of inspection equipment to over 30 semiconductor and LED manufacturers in more than 10 countries positions its equipment as a global market standard. This includes a robust global network with major clients such as Samsung Electronics, SK Hynix, Micron, AMD, and Qualcomm.Supply of inspection equipment to over 30 semiconductor and LED manufacturers in more than 10 countries positions its equipment as a global market standard. This includes a robust global network with major clients such as Samsung Electronics, SK Hynix, Micron, AMD, and Qualcomm.
- Continuous R&D investment based on unique core technologies expands its technology portfolio, securing numerous patents and strengthening its technological leadership. Successful defense in patent lawsuits related to semiconductor test rubber sockets exemplifies its proven technical superiority.Continuous R&D investment based on unique core technologies expands its technology portfolio, securing numerous patents and strengthening its technological leadership. Successful defense in patent lawsuits related to semiconductor test rubber sockets exemplifies its proven technical superiority.
- Successful development of fine-pitch arrangement technology for High Bandwidth Memory (HBM) probe cards and passing quality tests by major domestic and international memory semiconductor manufacturers mark its entry into a market previously dominated by foreign companies.Successful development of fine-pitch arrangement technology for High Bandwidth Memory (HBM) probe cards and passing quality tests by major domestic and international memory semiconductor manufacturers mark its entry into a market previously dominated by foreign companies.
- The company is the world's only provider of i3unify, an integrated interface solution for probe cards, interface boards, and test sockets, which are the three core test interconnection hardware components for high-performance semiconductor devices.The company is the world's only provider of i3unify, an integrated interface solution for probe cards, interface boards, and test sockets, which are the three core test interconnection hardware components for high-performance semiconductor devices.
- Target Industries
- Semiconductor industry: Wafer and package testing processes for memory semiconductors (DRAM, NAND Flash, HBM) and non-memory semiconductors (AP, CIS, CPU, GPU, PMIC, SoC).Semiconductor industry: Wafer and package testing processes for memory semiconductors (DRAM, NAND Flash, HBM) and non-memory semiconductors (AP, CIS, CPU, GPU, PMIC, SoC).
- Display industry: High-precision inspection equipment for OLED and LED panels, including high-resolution OLED and AR/VR displays.Display industry: High-precision inspection equipment for OLED and LED panels, including high-resolution OLED and AR/VR displays.
- Secondary battery industry: Expanding its business into the secondary battery sector, seeking new growth engines.Secondary battery industry: Expanding its business into the secondary battery sector, seeking new growth engines.
- Major Markets
- South Korea, China, Taiwan, Southeast AsiaSouth Korea, China, Taiwan, Southeast Asia
- EuropeEurope
- USAUSA
- Certifications/Patents
- Patents: Holding over 193 patents (as of 2024), with more than 110 registered patents related to test sockets. Proven technical superiority through winning patent lawsuits concerning semiconductor test rubber sockets.Patents: Holding over 193 patents (as of 2024), with more than 110 registered patents related to test sockets. Proven technical superiority through winning patent lawsuits concerning semiconductor test rubber sockets.
- Certifications and Awards: Awarded the "10 Million Dollar Export Tower" in 2004, "50 Million Dollar Export Tower" and "Dongtap Industrial Medal" in 2007, and "100 Million Dollar Export Tower" in 2021. Recipient of the "Korean Trader of the Year Award" in 2021. Holds a "Management Innovation Small and Medium Business Confirmation" and ISO9001 quality assurance system certification.Certifications and Awards: Awarded the "10 Million Dollar Export Tower" in 2004, "50 Million Dollar Export Tower" and "Dongtap Industrial Medal" in 2007, and "100 Million Dollar Export Tower" in 2021. Recipient of the "Korean Trader of the Year Award" in 2021. Holds a "Management Innovation Small and Medium Business Confirmation" and ISO9001 quality assurance system certification.
- Designated as an "Excellent Technology Company" by the Korea Technology Finance Corporation in 2001.Designated as an "Excellent Technology Company" by the Korea Technology Finance Corporation in 2001.
Introduction
Location
189 Gunsu 1-gil, Jiksan-eup, Seobuk-gu, Cheonan, Chungcheongnam-do, South Korea
클릭하여 위치 살펴보기
