System Engineering Mega Solution
SDB-3000MD Plus
Model
Series
Semiconductor Equipment
Transaction Process
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Payment
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Delivery
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Shipment
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Origin
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Description
Overview
This machine is to attach chips on leadframes/PCBs at high speed.
Feature
High Productivity and Excellent Accuracy
- Placement Accuracy : ±6㎛ @ SRM - UPEH : Max 7,000
- High Performance Vision Installation (Substrate/ Die / Wafer/ Under vision)
- Inspection : Crack / Particle / Align miss
- MCP Stack Package ( 16 Chip Stack ↑)
- Thin Die Handling System : Thin Die 25 ㎛ & Eject Time : 0.3Sec
Various Handling Capability
- Wafer Bin Grade Work Capability & Heterogeneous Package Product / Two Rail
- Full Auto Device Change & Material Automation System
- Wafer/ MGZ/ Heterogeneous PCB & Mixed Handling System