System Engineering Mega Solution
System Engineering Mega Solution
1/1
BLUEICE SPM
Model
Series
Semiconductor Equipment
Transaction Process
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Payment
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Delivery
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Shipment
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Origin
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Description
Overview
The 300mm single wafer processing equipment that is used for post CMP clean, PR strip, ashingless PR strip and metal removal processes.
Feature
Process Performance
- High Temperature SPM Process over 150℃
- PR Strip, Post CMP Clean, Metal Clean and etc.
Productivity / Hardware
- Contamination Free Clean by NIC Bowl
- H2SO4 Recycle System
- Energy Efficiency Rating : Class 1
Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664
ⓒ2024 Komachine Inc. All rights reserved.