System Engineering Mega Solution
BLUEICE PRIME
Model
Series
Semiconductor Equipment
Transaction Process
Please contact the manufacturer/supplier.
Payment
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Delivery
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Shipment
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Origin
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Description
Overview
The Single Wafer Wet Clean/PR Strip System for developing System LSI’s L1Xnm< device.
Feature
Process Performance
- High Grade Process (19nm)
- Defect Free Physical Cleaning
Productivity / Hardware
- Contamination Free Clean by NIC Bowl
- Leaning Free by CDA System
- SF-Aerosol : High-Velocity / Uniformity Droplet
- Smart System : APAC (Auto Flow Control), Smart Equipment Analysis System, Auto Inspection System