SFA Semicon, The Republic of Korea - Komachine Supplier Profile and Product List

- A semiconductor post-processing specialist providing total solutions from bumping to testing for LSI and memory products, establishing an integrated production system and serving as a global packaging solution providerA semiconductor post-processing specialist providing total solutions from bumping to testing for LSI and memory products, establishing an integrated production system and serving as a global packaging solution provider
- Possession of advanced wafer-level package technologies including FO-WLP (Fan Out Wafer Level Package), CoC (Chip on Chip), and CoW (Chip on Wafer)Possession of advanced wafer-level package technologies including FO-WLP (Fan Out Wafer Level Package), CoC (Chip on Chip), and CoW (Chip on Wafer)
- Provision of high-performance flip-chip based packaging solutions such as FCCSP (Flip Chip Chip Scale Package) and FCBGA (Flip Chip Ball Grid Array)Provision of high-performance flip-chip based packaging solutions such as FCCSP (Flip Chip Chip Scale Package) and FCBGA (Flip Chip Ball Grid Array)
- Production of a broad range of packaging products including FBGA (Fine-pitch Ball Grid Array), FBGA Stack Die, SIP (System in Package), PBGA (Plastic Ball Grid Array), QFN (Quad Flat No Leads), TSOP (Thin Small Outline Package), DIP, QFP, and SOPProduction of a broad range of packaging products including FBGA (Fine-pitch Ball Grid Array), FBGA Stack Die, SIP (System in Package), PBGA (Plastic Ball Grid Array), QFN (Quad Flat No Leads), TSOP (Thin Small Outline Package), DIP, QFP, and SOP
- Capability for producing TO-220 model semiconductor packagesCapability for producing TO-220 model semiconductor packages
- Development and supply capabilities for memory chips, modules, micro SD cards, SD cards, and next-generation memory modules like DDR4 SODIMM, UDIMM, and Registered DIMMDevelopment and supply capabilities for memory chips, modules, micro SD cards, SD cards, and next-generation memory modules like DDR4 SODIMM, UDIMM, and Registered DIMM
- Securing expertise in thin wafer handling, die stacking, different kind chip stacking technologies, and Ag/Cu wire bonding technologySecuring expertise in thin wafer handling, die stacking, different kind chip stacking technologies, and Ag/Cu wire bonding technology
- Continuous efforts in HBM quality innovation through the development of AI-based non-destructive inspection equipment technologyContinuous efforts in HBM quality innovation through the development of AI-based non-destructive inspection equipment technology
- High production efficiency achieved through an integrated production system from bumping to testing for LSI and memory productsHigh production efficiency achieved through an integrated production system from bumping to testing for LSI and memory products
- Enhanced customer satisfaction through the development and supply of customized packaging productsEnhanced customer satisfaction through the development and supply of customized packaging products
- Strengthened cost and quality competitiveness through global production and supply chain networks via subsidiaries in the Philippines and ChinaStrengthened cost and quality competitiveness through global production and supply chain networks via subsidiaries in the Philippines and China
- Securing core bumping technology for flip-chip and possessing wafer-level package manufacturing technologySecuring core bumping technology for flip-chip and possessing wafer-level package manufacturing technology
- Establishment of technological barriers through continuous R&D investment and intellectual property acquisitionEstablishment of technological barriers through continuous R&D investment and intellectual property acquisition
- Operation of a stringent quality management system and acquisition of the latest quality system standard certificationsOperation of a stringent quality management system and acquisition of the latest quality system standard certifications
- Contribution to post-processing yield improvement through the adoption of AI-based vision inspection systemsContribution to post-processing yield improvement through the adoption of AI-based vision inspection systems
- Strategic partnerships with global customers and flexible operational support capabilitiesStrategic partnerships with global customers and flexible operational support capabilities
- Mobile devices (smartphones, DMB phones, PDAs, etc.) and portable electronic device industriesMobile devices (smartphones, DMB phones, PDAs, etc.) and portable electronic device industries
- Personal computers (desktops, notebooks, workstations) and server, data center industriesPersonal computers (desktops, notebooks, workstations) and server, data center industries
- Consumer audio/video/entertainment (digital cameras, video cameras, MP3 players) industriesConsumer audio/video/entertainment (digital cameras, video cameras, MP3 players) industries
- Communication, RF/wireless, PC card, telemetry, and other communication and wireless communication industriesCommunication, RF/wireless, PC card, telemetry, and other communication and wireless communication industries
- Office automation and peripheral equipment (fax machines, copiers, printers) industriesOffice automation and peripheral equipment (fax machines, copiers, printers) industries
- Automotive electronic components and systems sectorAutomotive electronic components and systems sector
- AI semiconductors and High Bandwidth Memory (HBM) related advanced packaging fieldsAI semiconductors and High Bandwidth Memory (HBM) related advanced packaging fields
- South Korea, Philippines, China, Japan, Taiwan, Southeast AsiaSouth Korea, Philippines, China, Japan, Taiwan, Southeast Asia
- Acquisition of ISO 9001 (Quality Management System) certificationAcquisition of ISO 9001 (Quality Management System) certification
- Acquisition of IATF 16949 (Automotive Quality Management System) certificationAcquisition of IATF 16949 (Automotive Quality Management System) certification
- Acquisition of ISO 14001 (Environmental Management System) certificationAcquisition of ISO 14001 (Environmental Management System) certification
- Acquisition of ISO 45001 (Occupational Health and Safety Management System) certificationAcquisition of ISO 45001 (Occupational Health and Safety Management System) certification
- Acquisition of ISO 27001 (Information Security Management System) certificationAcquisition of ISO 27001 (Information Security Management System) certification
- Acquisition of RBA (Responsible Business Alliance) certificationAcquisition of RBA (Responsible Business Alliance) certification
- Acquisition of Common Criteria certificationAcquisition of Common Criteria certification
- Possession of SAMSUNG ECO Partner and SONY Green Partner certificationsPossession of SAMSUNG ECO Partner and SONY Green Partner certifications
- Ongoing efforts to secure intellectual property rights related to core technologies such as flip-chip bumping technologyOngoing efforts to secure intellectual property rights related to core technologies such as flip-chip bumping technology
- Selection as the lead research institution for a national project on AI-based non-destructive inspection equipment technology developmentSelection as the lead research institution for a national project on AI-based non-destructive inspection equipment technology development