common.FsCIvcommon.dfb6kcommon.v9ZjI
common.ml38d
common.Cu8Rvcommon.nFEXt
common.Llr7icommon.HXucWcommon.b6snf
KOR

ENG
  • KSEM

    KSEM

    /companies/[slug].xmlf6

    K-SEM, DIE Bonder & Sorter Manufacturer, the company is built with the professsional engineers from SEMES, a subsidiary company of Samsung. 

    KSEM manufacture DIe Bonder and Sorter equipment for semiconductor, display, and camera module productions.

    We provide total solutions for Micro LED & Mini LED, DDI, IC, LSI, Image Sensor, WLP & PLP, and CELL Type Tape Full Auto Lamination Solution Equipment.

     

    041-579-0943
    041-901-4136
    70, Namgwan-gil, Pungse-myeon, Dongnam-gu, Cheonan-si, Chungcheongnam-do

    /companies/[slug].qppxt

    High-speed, high-accuracy die bonder for 8 inch wafer IC・LSI
    AD-100
    High-speed, high-accuracy die bonder for IC and LSI compatible with 8, 12 inch wafers.
    AD-200
    High-accuracy & High Production die bonder for Stacked NAND flash compatible with 12 inch wafers.
    AD-300
    High performance FO-PLP BONDER
    AD-400

    Tape Full Auto Lamination For Cell
    ALM-100